Suresh K. Sitaraman

Georgia Institute of Technology

Professor

George W. Woodruff School of Mechanical Engineering

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Research Area

#Materials science#Composite material#Microelectronics#Soldering#Electronic engineering#Delamination#Flexible electronics#Optoelectronics#Fracture mechanics#Fabrication

SCIE paper information

Papers relevant to ‘Materials science’: 23

Research performance of SCIE papers matching with ‘Materials science’

Citations of SCIE papers SCIE papers 020k40k60k80k100k02004006008001k1.2k1.4k1.6k

*Papers published between 2014 and 2020 were selected, and the citation number was determined by bing.com.

  • Waviness reduces effective modulus of carbon nanotube forests by several orders of magnitude

    2014/01 CARBON 6.196 Impact Factor 71 citations

    Nicholas J. Ginga, Wei Chen, Suresh K. Sitaraman

    DOI : 10.1016/J.CARBON.2013.08.042

  • Study of Chip–Package Interaction Parameters on Interlayer Dielectric Crack Propagation

    2014/03 IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY 1.89 Impact Factor 19 citations

    Sathyanarayanan Raghavan, Ilko Schmadlak, George Leal, Suresh K. Sitaraman

    DOI : 10.1109/TDMR.2013.2288255

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Papers for author ‘Suresh K. Sitaraman’: 29

Number of published SCIE papers by year

024682014201520162017201820192020
H-index 9
Number of NCS papers 0

*Papers published between 2014 and 2020 were selected, and the citation number was determined by bing.com.

  • Waviness reduces effective modulus of carbon nanotube forests by several orders of magnitude

    2014/01 CARBON 6.196 Impact Factor 71 citations

    Nicholas J. Ginga, Wei Chen, Suresh K. Sitaraman

    DOI : 10.1016/J.CARBON.2013.08.042

  • A Review of Two-Phase Forced Cooling in Three-Dimensional Stacked Electronics: Technology Integration

    2015/12 JOURNAL OF ELECTRONIC PACKAGING 1.402 Impact Factor 29 citations

    Craig Green, Peter Kottke, Xuefei Han, Casey Woodrum, Thomas Sarvey, Pouya Asrar, Xuchen Zhang, Yogendra Joshi, Andrei G. Fedorov, Suresh K. Sitaraman, Muhannad Bakir

    DOI : 10.1115/1.4031481

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