Kyung-Wook Paik

Kyung-Wook Paik

Korea Advanced Institute of Science and Technology

Professor

Department of Materials Science and Engineering

Research Area

  • #Materials science
  • #Composite material
  • #Interconnection
  • #Soldering
  • #Epoxy
  • #Electrical conductor
  • #Solid-state physics
  • #Polymer
  • #Curing (food preservation)
  • #Nanofiber

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Related papers to
‘ Materials science ‘ : 19

  • Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging

    2018/04

    6.3 Impact Factor

    42 citations

    Dongju Lee, Seyong Lee, Segi Byun, Kyung-Wook Paik, Sung Ho Song

    DOI : 10.1016/J.COMPOSITESA.2018.01.009

    • #Materials science
    • #Composite material
    • #Dielectric
    • #Epoxy
    • #Nanocomposite
    • #Thermal conductivity
    • #Ball mill
    • #Electronic packaging
    • #Ionic bonding
    • #Dielectric loss

All papers authored by
‘ Kyung-Wook Paik ’ : 19

  • Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging

    2018/04
    COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING

    6.3 Impact Factor

    42 citations

    Dongju Lee, Seyong Lee, Segi Byun, Kyung-Wook Paik, Sung Ho Song

    DOI : 10.1016/J.COMPOSITESA.2018.01.009

    • #Materials science
    • #Composite material
    • #Dielectric
    • #Epoxy
    • #Nanocomposite
    • #Thermal conductivity
    • #Ball mill
    • #Electronic packaging
    • #Ionic bonding
    • #Dielectric loss

Related papers to
‘ Materials science ‘ : 19

  • Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging

    2018/04
    COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING

    6.3 Impact Factor

    42 citations

    Dongju Lee, Seyong Lee, Segi Byun, Kyung-Wook Paik, Sung Ho Song

    DOI : 10.1016/J.COMPOSITESA.2018.01.009

    • #Materials science
    • #Composite material
    • #Dielectric
    • #Epoxy
    • #Nanocomposite
    • #Thermal conductivity
    • #Ball mill
    • #Electronic packaging
    • #Ionic bonding
    • #Dielectric loss
  • Strength dependence of epoxy composites on the average filler size of non-oxidized graphene flake

    2017/03
    CARBON

    7.1 Impact Factor

    39 citations

    Jin Kim, Jungmo Kim, Sung Ho Song, Shuye Zhang, Jaemin Cha, Kisun Kim, Hyewon Yoon, Yeonwoong Jung, Kyung-Wook Paik, Seokwoo Jeon

    DOI : 10.1016/J.CARBON.2016.11.023

    • #Materials science
    • #Composite material
    • #Ultimate tensile strength
    • #Graphene
    • #Carbon nanotube
    • #Epoxy
    • #Nanocomposite
    • #Toughness
    • #Exfoliation joint
    • #Elastic modulus

Get access to
Contact information

Log in

All papers authored by
‘ Kyung-Wook Paik ’ : 19

  • Novel dielectric BN/epoxy nanocomposites with enhanced heat dissipation performance for electronic packaging

    2018/04
    COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING

    6.3 Impact Factor

    42 citations

    Dongju Lee, Seyong Lee, Segi Byun, Kyung-Wook Paik, Sung Ho Song

    DOI : 10.1016/J.COMPOSITESA.2018.01.009

    • #Materials science
    • #Composite material
    • #Dielectric
    • #Epoxy
    • #Nanocomposite
    • #Thermal conductivity
    • #Ball mill
    • #Electronic packaging
    • #Ionic bonding
    • #Dielectric loss
  • Strength dependence of epoxy composites on the average filler size of non-oxidized graphene flake

    2017/03
    CARBON

    7.1 Impact Factor

    39 citations

    Jin Kim, Jungmo Kim, Sung Ho Song, Shuye Zhang, Jaemin Cha, Kisun Kim, Hyewon Yoon, Yeonwoong Jung, Kyung-Wook Paik, Seokwoo Jeon

    DOI : 10.1016/J.CARBON.2016.11.023

    • #Materials science
    • #Composite material
    • #Ultimate tensile strength
    • #Graphene
    • #Carbon nanotube
    • #Epoxy
    • #Nanocomposite
    • #Toughness
    • #Exfoliation joint
    • #Elastic modulus

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